Event Schedule

SEMICON Korea 2022

The highlights

  • Machine: DWR1722
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Narrow Street Solution (MUSUBI, SDBG, DBG etc)
  • Laser Processing(Ablation, Stealth dicing)
  • Advanced Package Processing
  • SiC Solution

Recommendation