Go to top of
Corporate Outline

Course List

* If the training you request is not in the list, please contact your nearest DISCO affiliate office or agent.
* Most Operation and Tier 1 trainings are offered by DISCO affiliate office or agent.
* For training fees, please contact a DISCO affiliate office or agent for a quotation.
* Specifications for equipment installed at customer sites may differ from those used for training. The trainer will give additional explanations verbally, without training materials. Equipment with certain features/user-specifications may not be available at the Training Center. We appreciate your understanding.

Dicing Saw

DAD3220

Capacity (person):4

DAD3430

Target model:DAD3430, DAD3230

Capacity (person):4

DAD3350

Capacity (person):4

DAD3650

Capacity (person):4

DFD6340

Capacity (person):4

Target model:DFD6340,DFD6341

DFD6361

Capacity (person):4

Target model:DFD6361,DFD6360,DFD6362

DFD6560

Capacity (person):2

DFD6750

Capacity (person):2

*1 This training course is standard for 3000 series equipment. The training may take place using an equipment model other than the one you own.
*2 This training course is standard for 6000 series equipment. The training may take place using an equipment model other than the one you own.

Laser Saw

DFL7160

Capacity (person):4

DFL7161

Capacity (person):4

DFL7361

Capacity (person):2

DFL7362

Capacity (person):2

*3 This training course is standard for 7100 series equipment. The training may take place using an equipment model other than the one you own.

Grinder

DFG8540

Capacity (person):4

DGP8760

Capacity (person):4

DGP8761

Capacity (person):4

Mounter

DFM2800

Capacity (person):4

Die Separator

DDS2300

Capacity (person):2

Option

Option

* The courses are available only for those who take Operation, Maintenance 1, Maintenance 2 or Tier 1 - 3 courses. (Regardless to the type of equipment)
* Applications for the optional courses alone will not be accepted.
* The end time on the first day of the training will change according to the hours needed for the optional course.
Please contact us for any inconveniences.

Kiru, Kezuru, Migaku Solutions Training

Solutions

Process Introduction by Device

Latest Processing Technologies in Wafer Level Package Manufacturing
  • 2.5hours

    The wafer level packaging (WLP) manufacturing process is gradually recapturing attention in recent years. In this seminar, we introduce the latest Kiru, Kezuru, and Migaku processing technologies in the WLP manufacturing process, and discuss the latest topics, from basic technologies, to warpage countermeasures for wafer thinning and challenges in Low-k processing.

Latest Thinning Technologies in Memory Production
  • 1hour

    In this seminar, we introduce the latest processing technologies in memory production, focusing on the NAND thinning process, which drives the wafer ultra-thinning market, and discuss the latest topics, from basic technologies, to the DBG and SDBG processes used in mass production.

Latest Thinning Technologies in Power Device Manufacturing
  • 1hour

    Power devices are widely used in diversified equipment and are also becoming popular in saving energy and reducing CO2 emissions. In this seminar, we introduce the latest processing technologies in power device manufacturing, and discuss the latest topics, from basic market information, to SiC power devices.


Recommendation