Laser Dicing

Ablation process

This method focuses laser energy onto a minute area for a very short time, thereby subliming and evaporating the solid.

Stealth Dicing™ Process

"Stealth Dicing™ process" forms a modified layer in the workpiece by focusing a laser inside the workpiece, and then a tape expander is used to separate the die.

Processing Sapphire with Lasers

The range of applications for high-intensity LEDs has begun to expand. In addition to cell phones, they are used in liquid-crystal TV backlights, car headlights, and lighting. Mid- to long-term growth in the market is expected. When processing the sapphire used in high-intensity LEDs, separation using a diamond scriber and breaking has been the standard. However, as the market has grown, there has been strong demand for improved throughput and yield ratios. Laser processing has rapidly become more prevalent, and it is becoming the standard for processing sapphire for use in high-intensity LEDs. This page describes sapphire processing using DISCO's laser saw.

DBG + DAF Laser Cut

DBG (Dicing Before Grinding)*1 process is capable of reducing backside chipping by separating the dies during grinding, which also improves die strength. In addition, because the wafer is separated into dies at the end of the grinding process, a reduction in the risk of wafer breakage can be expected during thin grinding. By applying DAF (Die Attach Film)*2 to the DBG process, it is possible to develop a DBG process for the manufacturing of packages with stacked thin dies, such as SiP (System in Package). When applying DAF to the DBG process, it is necessary to attach the DAF on the backside of the die separated wafer and then cut just the DAF. DISCO engineers have developed an application to laser cut the DAF at this juncture.

Laser Full Cut Dicing

Compound semiconductors, such as GaAs (Gallium Arsenide), are used in high frequency devices. When blade dicing compound semiconductors with an existing diamond blade, the feed speed is slow and high productivity is difficult to obtain. With the trend towards high integration, based on such technology as SiP (System in Package), high-strength thin-die manufacturing technology has become necessary. However, with blade dicing, as the thickness of the wafer becomes thinner, dicing difficulty increases. To solve this kind of issue, DISCO has optimized the laser head and optical system of the DFL7161 laser saw to establish a laser full cut application.

Low-k Grooving

The mechanical strength of low-K film used as insulating film for high-speed logic is low, and thus, there is the risk of film peeling when the normal blade dicing process is used. The low-K grooving process removes the wiring layer, including the low-K film, using laser grooving equipment.