DBG/SDBG
-
DBG (Dicing Before Grinding) Process
DBG reverses the usual process of fully dicing the wafer after grinding. In DBG, first the wafer is half-cut with a special dicing saw. Then, die singulation occurs when the wafer is thinned below the level of this cut. The wafer then goes to the in-line DBG Mounter, which gently peels off the protective grinding tape, completing the process.
-
SDBG (Stealth Dicing Before Grinding) Process
Smartphones and tablets are continually becoming thinner and supporting a higher processing capacity, which means that flash memory and memory controller chips must also become thinner. Current processes are focused on reducing chipping and improving thin wafer handling. The SDBG process not only addresses these issues but also makes the following possible:
Applications Example
-
Applications Support
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Details -
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.
Details