The Letter of Compliance service for IATF 16949, a quality management system about which a news release was issued on March 17, 2022, has been abolished by the certification organization. From the beginning, DISCO’s purpose in conducting these quality management activities was not the acquisition of this certification. Therefore, moving forward, the manufacturing of major precision processing tool products at Hiroshima Works Kure Plant and Kuwabata Plant will continue to be conducted in compliance with the IATF 16949 quality management system, and DISCO will continue to undergo audits for IATF 16949 requirements, in addition to ISO 9001 requirements, during the annual ISO 9001 audits implemented by the third party certification body.
In doing so, DISCO will continue to respond to the strict quality requirements, such as safety and reliability, required by the automotive industry.

(Reference) News release announced on March 17, 2022
DISCO has Acquired Letters of Compliance for IATF 16949, a Quality Management System for the Automotive Sector, for All Major Precision Processing Tool Products

About DISCO Corporation
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electrical components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used in the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors domestically and internationally. For details, please view the DISCO website www.disco.co.jp.