Course List

• Dicing Saw
• Laser Saw
• Grinder
• Mounter
• Die Separator
• Option
• Kiru, Kezuru, Migaku Solutions Training
• Process Introduction by Device

* If the training you request is not in the list, please contact your nearest DISCO affiliate office or agent.
* Most Operation and Tier 1 trainings are offered by DISCO affiliate office or agent.
* For training fees, please contact a DISCO affiliate office or agent for a quotation.
* Specifications for equipment installed at customer sites may differ from those used for training. The trainer will give additional explanations verbally, without training materials. Equipment with certain features/user-specifications may not be available at the Training Center. We appreciate your understanding.

Dicing Saw

DAD3220

Capacity (person):4

• 2days
  Operation※1
• 2days
  Operation (Measurement Alignment Package)※1 About the measurement alignment function
• 2days
  Maintenance1
• 2days
  Maintenance2

DAD3430

Target model：DAD3430, DAD3230

Capacity (person):4

• 2days
  Operation※1
• 2days
  Operation (Measurement Alignment Package)※1 About the measurement alignment function
• 2days
  Maintenance1
• 2days
  Maintenance2

DAD3350

Capacity (person):4

• 2days
  Operation※1
• 2days
  Operation (Measurement Alignment Package)※1 About the measurement alignment function
• 2days
  Maintenance1
• 3days
  Maintenance2

DAD3650

Capacity (person):4

• 1day
  Tier1
• 3days
  Tier2
• 3days
  Tier2 (Measurement Alignment Package) About the measurement alignment function

DFD6340

Capacity (person):4

Target model:DFD6340,DFD6341

• 3days
  Operation※2
• 3days
  Operation (Measurement Alignment Package)※2 About the measurement alignment function
• 2days
  Maintenance1
• 2days
  Maintenance2

DFD6361

Capacity (person):4

Target model:DFD6361,DFD6360,DFD6362

• 3days
  Operation※2
• 3days
  Operation (Measurement Alignment Package)※2 About the measurement alignment function
• 3days
  Operation(Half-cut Specification)※2
• 2days
  Maintenance1
• 3days
  Maintenance1(Half-cut Specification)
• 2days
  Maintenance2
• 3days
  Maintenance2(Half-cut Specification)

DFD6560

Capacity (person):2

• 3days
  Operation※2
• 2days
  Maintenance1
• 2days
  Maintenance2

DFD6750

Capacity (person):2

• 1day
  Tier1
• 3days
  Tier2
• 3days
  Tier3

*1 This training course is standard for 3000 series equipment. The training may take place using an equipment model other than the one you own.
*2 This training course is standard for 6000 series equipment. The training may take place using an equipment model other than the one you own.

Laser Saw

DFL7160

Capacity (person):4

• 1day
  Tier1※3
• 3days
  Tier2
• 1day
  Tier3

DFL7161

Capacity (person):4

• 1day
  Tier1※3
• 4days
  Tier2
• 5days
  Tier2(BSS6 Specification)
• 1.5days
  Tier3

DFL7361

Capacity (person):2

• 1day
  Tier1
• 3days
  Tier2

DFL7362

Capacity (person):2

• 1day
  Tier1
• 3days
  Tier2

*3 This training course is standard for 7100 series equipment. The training may take place using an equipment model other than the one you own.

Grinder

DFG8540

Capacity (person):4

• 2days
  Tier2
• 3days
  Tier3

DGP8760

Capacity (person):4

• 2days
  Operation
• 2days
  Maintenance1
• 3days
  Maintenance2

DGP8761

Capacity (person):4

• 1day
  Tier1
• 3days
  Tier2
• 3.5days
  Tier3

Mounter

DFM2800

Capacity (person):4

• 1day
  Tier1
• 2days
  Tier2
• 3days
  Tier3

Die Separator

DDS2300

Capacity (person):2

• 1day
  Tier1
• 3days
  Tier2

Option

Option

• 1hour
  Basics of Blades
• 1.5hours
  Basis of Grinding and Polishing

* The courses are available only for those who take Operation, Maintenance 1, Maintenance 2 or Tier 1 - 3 courses. (Regardless to the type of equipment)
* Applications for the optional courses alone will not be accepted.
* The end time on the first day of the training will change according to the hours needed for the optional course.
Please contact us for any inconveniences.

Kiru, Kezuru, Migaku Solutions Training

Solutions

• 1day
  Basics of Dicing Saw Application
• 2hours
  Basics of Laser Saw (Ablation) Application
• 1day
  Basics of Grinder Application
• 1day
  Basics of Grinding Process and Wheels

Process Introduction by Device

Latest Processing Technologies in Wafer Level Package Manufacturing

• 2.5hours

  The wafer level packaging (WLP) manufacturing process is gradually recapturing attention in recent years. In this seminar, we introduce the latest Kiru, Kezuru, and Migaku processing technologies in the WLP manufacturing process, and discuss the latest topics, from basic technologies, to warpage countermeasures for wafer thinning and challenges in Low-k processing.

Latest Thinning Technologies in Memory Production

• 1hour

  In this seminar, we introduce the latest processing technologies in memory production, focusing on the NAND thinning process, which drives the wafer ultra-thinning market, and discuss the latest topics, from basic technologies, to the DBG and SDBG processes used in mass production.

Latest Thinning Technologies in Power Device Manufacturing

• 1hour

  Power devices are widely used in diversified equipment and are also becoming popular in saving energy and reducing CO2 emissions. In this seminar, we introduce the latest processing technologies in power device manufacturing, and discuss the latest topics, from basic market information, to SiC power devices.