Operations
1. Contract manufacturing of semiconductor and electronic components
2. Planning and development of manufacturing lines, manufacturing facilities, and manufacturing equipment for semiconductor and electronic components
3. Planning and development of raw materials and parts for semiconductor and electronic components
Operations
Manufacturing and sales of electric machinery and apparatuses, including electric motors, dynamos,
static power source equipment, automatic control devices.
Location of Head Office
Location of Hiroshima Works
Operations
Contract manufacturing of DISCO products, including precision processing equipment, precision processing tools, and related equipment.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, related machines and
Applications Support.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, related machines and
Applications Support.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, related machines and
Applications Support.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, related machines and
Applications Support.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, related machines and
Applications Support.
Sales Activities
Sales support and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, and related
machines.
Sales Activities
Sales and maintenance of DISCO's dicing/cutting saws, grinders, blades/wheels, and related machines.