DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed DIS100, a unit that picks up die from the wafer after dicing and measures die thickness, chipping, backside surface roughness, and die strength* fully automatically. Efficient and highly accurate measurement is achieved by automating all of the existing manual processes.
In addition, DIS100 records measurement data. Therefore, it also improves traceability, as required in quality audits of automotive devices.

* Die strength
The largest stress when the die is bent until it breaks. The higher the die strength is, the less die breakage occurs, which contributes to improved yield and reliability for the final devices.

R&D Background

From a safety perspective, quality management is especially important for automotive devices, for which demand is increasing due to the development of self-driving and electric vehicles. In addition, high die strength is required for die used in memory devices, which are continually becoming thinner with storage capacity becoming larger.
Because there was no equipment to automatically measure die thickness, chipping, backside surface roughness, or die strength, there were issues caused by manual operation, including measurement variation and high inspection labor costs.
DIS100 achieves stable fully automatic die strength measurement and efficient die quality management.

DIS100 Product Features

Fully automatic inspection from die pick up to die strength measurement

After the user simply sets a frame cassette to DIS100 after dicing, DIS100 automatically picks up the designated die, measures die thickness, chipping**, backside surface roughness, and die strength (breakage test), and monitors the conditions when the die breaks using a high-speed camera***.

UNITRAY Specification** for storing die after inspection

At automotive device manufacturers, demand is increasing for die storage in addition to quality recording for improved traceability.
DISCO UNITRAY specification achieves compact storage by placing the designated die on a UNITRAY, specially developed by DISCO, after sidewall and backside measurement.
Management information, including wafer lot number, is converted into a bar code so that die can be managed through tray labeling. It is possible to access the die data easily by scanning the bar code.

What is UNITRAY?

DIS100 Functions

Die sidewall measurement**

Die backside measurement (white-light interferometry)**

Die strength measurement using three-point bending

Breakage monitoring using high-speed camera***

** Optional
*** User-specified

Equipment Display

Future Schedule

Panel and video exhibition at SEMICON Japan Virtual

• Live streaming: December 14 (Monday)–17 (Thursday), 2020
• On-demand streaming: December 11 (Friday), 2020–January 15 (Friday), 2021

Status

Available for purchase

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About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.