Development of DDS2030: Die Separator for Small Die Devices
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DDS2030, a fully automatic die separator that enables efficient singulation of small die devices.
This equipment will be exhibited at SEMICON Japan 2024 (December 11-13, Tokyo Big Sight).
Developmental Background
Stealth Dicing™ is a dicing process where a modified layer is formed by focusing a laser beam inside the workpiece, following which stress is applied externally to separate it into die.
As typical semiconductors such as logic and memory devices have relatively larger die, they can be separated just by expanding the dicing tape.
On the other hand, for LED display devices, analog devices, or high frequency devices, the die size can be as small as 1 mm or lower, and separation was difficult using just tape expansion. In addition, the conventional breaking method where a plate-shaped tool is pressed against the workpiece and breaking is performed one line at a time had a high yield, but a low throughput.
DDS2030 uses a newly developed “roller breaking method,” enabling separation of the abovementioned small die devices with a high throughput.
Features
- Installed with a roller breaking mechanism optimal for singulating small die devices
- Supports square die from 0.15 up to 0.5 mm in size
- High throughput
- Achieves a UPH of 36 Note: The results may differ based on the wafer and processing conditions. This data is for reference under certain conditions only and are not guaranteed by DISCO. Does not include the throughput of SD.
- Installed with mechanisms that automatically perform mounting and peeling of a protective film for the device surface
- All processes can be completed within one equipment
Future Schedule
| To be exhibited at SEMICON Japan 2024 | December 11 to 13, 2024 at Tokyo Big Sight |
|---|---|
| Test cuts | Accepting requests |
| Sales release | Accepting orders |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
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