Development of New Dicing Blades: ZHSC25 for SiC and Z25 for Electronic Components
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed two new dicing blades, the ZHSC25 Series and Z25 Series. These products will be exhibited at SEMICON Japan 2024 (December 11-13, Tokyo Big Sight).
Developmental Background
Power devices made from SiC wafers are superior in terms of power efficiency, and their use is spreading in order to achieve carbon neutrality. Due to the market expansion and demands for further productivity, DISCO has developed the ZHSC25 Series.
Features
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Improves throughput with high-speed processing
Achieves a processing speed approx. 2.5 times faster than the conventional product, while maintaining an equivalent processing quality. -
Improves equipment operation rates
When dicing difficult-to-process materials such as SiC, processing needs to be stopped after a certain number of cut lines in order to perform interval dressing to maintain the blade edge in good condition. The ZHSC25 Series reduces the frequency of interval dressing and improves equipment operation rates.
Developmental Background
In recent years, demands for higher dimensional accuracy in blade processing are increasing as electronic devices are getting smaller and more high-performance. In response to these needs, DISCO has developed the Z25 Series, which are hubless electroformed bond blades that have a high level of straightness even when processing at a deep cut depth with a thin blade, achieving high-accuracy processing.
Features
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Achieves a high level of straightness during processing
Significantly reduces slanted cut even when processing at a deep cut depth with a thin blade and achieves high dimensional accuracy. -
Improved blade life
Achieves a high level of straightness even at a longer blade exposure than the conventional product, improving blade life.
Future Schedule
| To be exhibited at SEMICON Japan 2024 | December 11 to 13, 2024 at Tokyo Big Sight |
|---|---|
| Test cuts | Accepting requests |
| Sales release | Accepting orders |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
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