In order to achieve low profile, high performance semiconductor packages and cost reduction, FOWLP (Fan-Out Wafer Level Packaging), a package manufacturing technology using φ300 mm wafers, was started approx. 10 years ago. Subsequently, for further cost reduction, PLP (Panel Level Packaging), another package manufacturing technology that uses large substrates or panel level workpieces, was devised.
DISCO released DFD6310, a dicing saw for large panels (up to 720 × 610 mm) in 2016, but there was an issue with productivity, as singulating a large workpiece all at once meant that large dicing saws would be occupied for long periods of time. With the newly-developed DFD6370, productivity improvement can be expected by performing singulation after splitting the panel-sized packages into 4 or 6 smaller workpieces using equipment such as DFD6310.
In addition, one of the reasons for developing DFD6370 was the increased demand for singulation after dividing larger panels into four 300 x 300 mm workpieces owing to the standardization of 600 mm square workpieces by SEMI in 2019.

• Supports singulation of workpieces with a maximum size of 330 x 330 mm


• Multiple-mounted workpiece processing
  Multiple strip substrates (300 x 100 mm, etc.) can be mounted on one frame and processed.



• Height control function (optional)
  It is possible to select a height measurement sensor suitable for the application. As highly accurate cut depth control is possible, it is effective for applications such as half-cut dicing for wettable flank-QFN substrates.