Development of DWR1730: A Deionized Water Recycling Unit that can Handle Large Flow Rates (Grinders, etc.)
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DWR1730, a deionized water recycling unit with the same functions as DWR1722, but with the added capacity of being able to handle equipment that require a large flow rate such as grinders.
This unit will be exhibited at SEMICON Japan 2024 (December 11-13, Tokyo Big Sight).
Developmental Background
Among the global expansion in semiconductor manufacturing, development of technology aiming at reduced environmental impact and costs are drawing even more attention than before.
DISCO consolidated the four functions of deionized water manufacturing, water temperature adjustment, filtration, and liquid waste disposal into a small, deionized water recycling unit, DWR1720, which was released in 2008. Subsequently, DWR1721, with a simplified unit layout, and DWR1722, with selective standard functions, were released.
The DWR was originally intended for dicing saws, but in recent years, due to the need for water recycling when grinding compound semiconductors such as Gallium arsenide (GaAs) and SiC as well, demand to support equipment that utilize a larger amount of DI water such as grinders has been increasing.
In order to respond to these needs, DISCO has developed DWR1730, which has an increased deionized water supply capacity while keeping the functions of the conventional DWR. This makes it possible to connect DWR1730 to equipment that require a large flow rate, such as grinders and when multiple equipment are connected, while reducing power consumption.
Features
- Compared to the conventional DWR1722, the feed water capability and chiller cooling performance have been significantly improved
Feed water capability is 2.4 times higher
The spindle cooling water feeding capability is 3 times higher, and the
chiller cooling performance is 3.9 times better
-
Reduces the chiller unit’s power consumption by monitoring the water temperature and water amount
Power consumption reduced by 20% compared to the conventional DWR through chiller cooling operation control
Automatically switches to energy-saving mode when there is no processing water supply for a specified period of time
-
Improved maintainability
Consumable replacement is possible even during full automation operation
Future Schedule
| To be exhibited at SEMICON Japan 2024 | December 11 to 13, 2024 at Tokyo Big Sight |
|---|---|
| Sales release | From mid-2025 |
About DISCO
DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components. In addition to these products, as a result of pursuing optimal processing results for customers through the provision of the technology used with the equipment and tools, DISCO products and processing technologies have been widely adopted by device manufacturers and semiconductor subcontractors both domestically and internationally. For details, please visit the DISCO website at www.disco.co.jp.
Contact
Please feel free to contact us with any questions or inquiries.