Disco Corporation (Head Office: Ota-ku; President Kazuma Sekiya) has developed DFX2400, a fully automatic expander compatible with Φ300 mm wafers. The DFX2400 will be displayed for the first time at SEMICON Japan 2017 (December 13-15, Tokyo Big Sight).
The size of semiconductor chips installed in mobile devices such as smartphones is becoming more
miniaturized. As the demand for sensors for IoT increases, it is expected that the production of small
chip devices will also increase. Stealth dicing (SD) using lasers is an effective form of dicing for this
application. After SD, the dicing tape is expanded resulting in chip division. However, in the subsequent
die bonding step it is necessary to retain the kerf width.
Meanwhile, display driver IC chips installed in LCD and OLED devices have a large aspect ratio, and the number of division lines varies greatly. Thus, the kerf width in the short side direction could not be maintained sufficiently using conventional methods, resulting in concerns regarding poor pickup during die bonding.
Employs a two-way (XY) expansion method.
* The process of removing sag from the dicing tape by shrinking the tape through the application of heat.
|December 2017||DFX2400 will be displayed at SEMICON Japan 2017|
|Summer 2018||Start of sales.|