The range of semiconductor applications, including those in the IoT, automotive, and medical fields, are continuously expanding, and the need for semiconductor manufacturing equipment is expected to increase in the future. In order to meet this demand, DISCO urgently needs to build a manufacturing facility and hire more employees. Expansion work is currently being done on the manufacturing building at Hiroshima Works Kuwabata Plant (Kure-city, Hiroshima). However, this expansion is primarily for meeting customer needs for precision processing tools¹, and the manufacturing space for semiconductor equipment will be limited in the future. Furthermore, DISCO’s manufacturing is focused in two plants, the Kuwabata Plant and the Kure Plant, located in Kure-city, Hiroshima. Even though countermeasures such as seismically isolated structures have been implemented, it is necessary to diversify risks for the purpose of BCM². In response to these issues, DISCO has decided to establish Nagano Works Chino Plant.

1 Precision processing tools: Consumables (blades, abrasive wheels, etc.) attached to equipment to perform cutting, grinding, and polishing.
2 Business Continuity Management