DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has changed all four models of semi-automatic dicing saw (DAD324, DAD3241, DAD3651, and DAD3661）with enhanced productivity and communication systems. The three models of DAD324, DAD3241, and DAD3651 will be exhibited at SEMICON Japan 2018 (held at Tokyo Big Sight from December 12 to 14.)
In recent years, the number of installed sensors and passive components made from glass and ceramic and
the demand for singulation and grooving of these materials have been increasing in response to the multi-
and high-functionality of smartphones, tablet devices, and other mobile devices.
However, it has been necessary to improve the productivity because glass and ceramic are
difficult-to-process materials which requires a considerable amount of processing time.
In addition, there is no advantage to installing equipment with an automatic transfer system because workpieces are replaced infrequently for materials with a longer processing time. Therefore, semi-automatic dicing saws without a built-in transfer mechanism have normally been employed. However, this can create problems in production sites with only one operator that has to keep track of the operation status of multiple units, increasing the need for a communication system to manage multiple units.
In response to such background, the model changes to DAD324, DAD3241, DAD3651, and DAD3661 have been made.
※1 Communication protocol in the semiconductor industry
SECS: SEMI Equipment Communications Standard, GEM: Generic Model For Communications and Control of Manufacturing Equipment
※3 Non-contact setup: This feature detects blade height using a transmission sensor without the need for the blade to make contact with the chuck table.
|Exhibited at SEMICON Japan 2018||December 12 – 14 (Tokyo Big Sight)|
|Test cuts||From March 2019|
|Equipment release||DAD324/DAD3241||From April 2019|
|DAD3651/DAD3661||From June 2019|