DISCO Corporation (Head Office: Ota-ku in Tokyo, President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed DAD3351, a model with reduced processing time and footprint. Additionally, DAD3361 and DAD3431 have also been developed. Along with the development of these three models, DISCO has also completed a model change for all nine semi-automatic dicing saw models, with improved productivity and communication support in all models.
For mass production, multiple units must be installed and simultaneously operated in parallel due to the time needed to process difficult-to-cut materials, such as glass and ceramics used for sensors and passive components. Thus, many production sites adopt manual dicing saws with simple functions, and a small group of operators control them. However, communication functions were limited in existing models, which made it difficult to control them centrally. For this reason, there was demand for communication support that would enable timely control of multiple dicing saws. Given this background, a model change was carried out for all nine existing semi-automatic dicing saw models.
The existing semi-automatic dicing saw DAD3350 is a best-selling model that flexibly supports a wide range of workpieces and has been delivered to many companies around the world. The newly developed DAD3351 has inherited the features of DAD3350, with a high-rigidity bridge-type frame for the spindle axis, which can withstand high-load processing, and high extensibility to support various options and user-specified specifications. Accompanying the model change (details below) carried out for all nine semi-automatic dicing saws, the following features have been improved.
*1 Semiconductor industry communication standards (SECS: SEMI Equipment Communications Standard, GEM: Generic Model for Communication and Control of Manufacturing Equipment)
*2 Function that detects blade height by using a transmission sensor, without the blade contacting the chuck table upper surface
|Supported workpiece size||Φ150 mm||Φ200 mm||Φ300 mm|
Equipment width: 490 mm
|December 2019||DAD324, DAD3351, and DAD3651 will be exhibited at SEMICON Japan 2019 (December 11 – 13, Tokyo Big Site)|
|January 2020||Sales release for DAD3351, DAD3361, and DAD3431
（Other semi-automatic dicing saws: Available for purchase）
*DAD3350 and other existing models are also available for purchase.