DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed DDS2320, a fully automatic die separator capable of processing Φ300 mm wafers that contributes to improved throughput and reliability in memory production.
This equipment will be exhibited at SEMICON Japan 2019 (December 11 to 13, Tokyo Big Sight).

Development Background

Features of DDS2320

Improved productivity

Efficient production of thin die is now possible due to the adoption of a newly developed expansion unit.

• Cool expansion and heat shrinking in one unit
  In previous models, separate processing units were used for cool expansion and heat shrinking, but DDS2320 conducts both processes using one unit. With workpiece transfer between units no longer required, DDS2320 achieves reduced risk of damage during transfer and improved productivity.
• Parallel processing with dual expansion unit
  Previous models had only one expansion unit, but DDS2320 has mounted two expansion units. This enables parallel processing, through which improved productivity can be expected. As with the previous model, DDS2320 can proceed directly to the die bonding process with the tape frame after heat shrinking.

Improved device reliability post-processing

Particle adhesion is reduced by performing processing and transfer after reversing the workpiece, leading to improved device reliability and yield.

• Reverse-side cool expansion / heat shrinking
  Re-adhesion is prevented by performing expansion and heat shrinking after turning the workpiece surface downward, causing particles produced during die singulation / tape expansion to fall off.
• Reverse-side spinner cleaning/transfer
  Spinner cleaning is performed after die singulation, with the workpiece surface still facing downward. This process further contributes to the reduction of particle adhesion.

Approximately 40% footprint reduction

In previous models, auxiliary equipment was installed in the area around the main equipment. DDS2320 achieves a smaller footprint by having the auxiliary equipment installed internally.

Schedule