DFM2800Fully Automatic Multifunction Wafer Mounter
Realizes faster processing of ultrathin wafers
- Φ300 mm
- DBG
- SDBG
- Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process. It also supports the attachment of DAF with integrated dicing tape, which is necessary for next generation SiP (System in Package) manufacturing.
Supports ultrathin wafers less than 25 μm thick
To support the thinning requirements of Φ300 mm wafers less than 25 μm thick, the breakage risk of ultra-thin wafers is minimized by reducing the number of wafer handling steps to only twenty percent that of the existing model. In addition, a cleaning mechanism has been installed at each handling pad/table to prevent wafer breakage caused by particle intrusion.
High throughput
By optimizing each transfer section, an approximate 50% increase* is realized in the maximum throughput for continuous operation. This greatly contributes to an improvement in productivity. (Compared to the DFM2700)
*The actual throughput depends on the wafer mount process time and surface protection tape peeling time.
Robust options to support various needs
- Robot/single load port unit when using the DFM2800 as a stand-alone unit
- Internal precut mechanism for dicing tape
- Surface protective tape peeling mechanism using adhesive tape
- Wafer surface ID recognition mechanism (vision system) for barcode control after wafer mounting
Easy operation
While the equipment operation method is inherited from the DFM2700, the screen size is larger with better visibility to for a user-friendly and easy to understand operational environment. Furthermore, in an in-line system with a DGP8761, the DFM2800 is even easier to use because of unified management, which makes recipe selection and start/stop on the DFM2800 possible from the DGP8761.
Work Flow System
- Workpiece reception from the grinder →
- UV irradiation to the front side protection tape on the workpiece (when the UV tape is used) →
- Workpiece transfer to the inspection table (when inspection is needed) →
- Alignment using image processing →
- Workpiece mounting with dicing tape or 2 in 1 DAF tape →
- Surface protective tape peeling from the workpiece →
- Tape frame storage (with mounted workpiece) in the cassette
Specifications
| Specification | Unit | |
|---|---|---|
| Supported workpiece size | mm | Φ200 / Φ300 |
| Wafer attachment precision and X/Y direction (frame mount) | mm | ±0.5 or less |
| Wafer attachment precision and θ direction (frame mount) | deg | ±0.5 or less |
| Dicing tape attachment precision and X/Y direction | mm | ±1.0 or less |
| Equipment dimensions(W×D×H) | mm | 2,150 × 2,643 × 1,800 |
| Equipment weight | kg | Approx.3,100 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
DFM2800Fully Automatic Multifunction Wafer Mounter
Contact
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