DFP8141Fully Automatic Polisher
CMP polisher designed to process hard-to-process materials such as sapphire and SiC
- Φ200 mm
- 1 axis, 2 chuck tables
- Wafer Thinning
- Stress Releaf
Fully automatic operation
The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.
For small workpieces made of difficult-to-process materials
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
A transfer system which supports three workpiece configurations
The transfer system accepts three workpiece configurations: single wafer transfer, substrate transfer, and frame transfer.
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Wafer diameter | - | Φ8 inch | |
| Polishing method | - | CMP | |
| Polishing wheel | - | Φ300 mm CMP pad | |
| Spindle | Rated output | kW | 7.5 | Revolution speed | min‐1 | 500 ～ 2,000 |
| Machine dimensions (W x D x H) | mm | 900 x 2,584 x 2,000 | |
| Machine weight | kg | Approx.3,100 | |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Spindle |
| C/T |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |
| DFP8140 | DFP8160 | DGP8761 |
| Fully Automatic | Fully Automatic | Fully Automatic |
| 1 | 1 | 3 |
| 1 | 1 | 4 |
| 1,200 × 2,670 × 1,800 | 1,400 × 3,322 × 1,800 | 1,690 × 3,315 × 1,800 |
| 1,900 | 2,400 | 6,700 |
DFP8141Fully Automatic Polisher
Contact
Please feel free to contact us with any questions or inquiries.