DAS8920Surface Planer
Semi-automatic surface planer for Φ8-inch wafers
- Φ200 mm
- 1 axis, 1 chuck table
- Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
Processing example
See here for processing examples.
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Supported workpiece size | - | Φ8 inch | |
| Number of spindles | - | 1 | |
| Number of chuck tables | - | 1 | |
| Transport/Cleaning | - | Without | |
| Process precision | TTV | µm | Less than 2.0 |
| 5 x 5 mm die bump height variation | µm | Less than 1.0 | |
| surface roughness | µm | Within Ra 0.02 | |
| Equipment dimensions (W × D × H) | mm | 500 x 1,250 x 1,780 | |
| Equipment weight | kg | Approx.800 | |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Spindle |
| C/T |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |
| DAS8930 | DFS8910 | DFS8960 |
| Automatic | Fully Automatic | Fully Automatic |
| 1 | 1 | 2 |
| 1 | 1 | 2 |
| 730 × 1,570 × 1,870 | 1,200 × 2,670 × 1,800 | 1,400 × 3,312 × 1,870 |
| 1,600 | 2,400 | 5,000 |
DAS8920Surface Planer
Contact
Please feel free to contact us with any questions or inquiries.