DFS8960Surface Planer
Fully-automatic surface planer for Φ300 mm wafers
- Φ300 mm
- 2 axes, 2 chuck tables
- Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
Processing example
See here for processing examples.
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Supported workpiece size | - | Φ300 mm | |
| Number of spindles | - | 2 | |
| Number of chuck tables | - | 2 | |
| Transport/Cleaning | - | With | |
| Process precision | TTV | µm | Less than 3.0 |
| 5 x 5 mm die bump height variation | µm | Less than 1.0 | |
| surface roughness | µm | Within Ra 0.02 | |
| Equipment dimensions (W × D × H) | mm | 1,400 x 3,312 x 1,870 | |
| Equipment weight | kg | Approx.5,000 | |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Spindle |
| C/T |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |
| DAS8920 | DAS8930 | DFS8910 |
| Automatic | Automatic | Fully Automatic |
| 1 | 1 | 1 |
| 1 | 1 | 1 |
| 500 × 1,235 × 1,800 | 730 × 1,570 × 1,870 | 1,200 × 2,670 × 1,800 |
| 800 | 1,600 | 2,400 |
DFS8960Surface Planer
Contact
Please feel free to contact us with any questions or inquiries.