The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.
See here for processing examples.
|Workpiece size||-||Φ300 mm|
|Number of spindles||-||2|
|Number of chuck tables||-||2|
|Process precision||TTV||µm||Less than 3.0|
|5 x 5 mm die bump height variation||µm||Less than 1.0|
|surface roughness||µm||Within Ra 0.02|
|Machine dimensions (W × D × H)||mm||1,400 x 3,312 x 1,870|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.