DBG (Dicing Before Grinding) Process

Solutions

Outline of DBG Process

DBG reverses the usual process of fully dicing the wafer after grinding. In DBG, first the wafer is half-cut with a special dicing saw. Then, die singulation occurs when the wafer is thinned below the level of this cut. The wafer then goes to the in-line DBG Mounter, which gently peels off the protective grinding tape, completing the process.

Because in DBG thinned wafers are never transported, wafer-level breakage is greatly reduced; and because die separation occurs during the grinding process, the backside chipping associated with thin-wafer dicing is kept to a minimum. DBG also offers exceptionally high die strength. For these reasons, DBG is an excellent process for processing 300 mm wafers into high-quality, ultra-thin die.