DCS1460Automatic Cleaning System
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.
Supports a diverse range of workpieces
The DCS1460 supports Φ3- to 12-inch tape and frame. The equipment also supports square workpiecesup 310 x 310 mm as an option.
Easy operation
A 4 inch LCD touch panel enables simple operation. The software supports the cleaning operation with easy to set cleaning sequences.
Atomizing cleaning
Mist generated by mixing fluid droplets with blasts of air is sprayed against the cleaning surface at high speeds. The resulting shockwave and expansion wave enable strong cleaning with minimal damage. (The atomizing cleaning specification is available as an option.)
Specifications
| Specification | Unit | DCS1460 |
|---|---|---|
| Max. workpiece size | - | Φ300 mm |
| Application frame | - | 2-12 |
| Table RPM | min-1 | 100 ～ 3,000 |
| Setting time for cleaning/drying | sec | 0 ～ 999 |
| Cleaning nozzle speed | °/sec | 1 ～ 37.5 |
| Cleaning range | mm | Φ450 (up to 310 x 310 mm) |
| Cleaning pressure range | Mpa | 2.3 ～ 11.8 |
| Equipment dimensions(W×D×H) | mm | 500 × 650 × 1,220 |
| Equipment weight(Dry mass) | kg | Approx.144 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
DCS1460Automatic Cleaning System
Contact
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