Ultrasonic-wave
Dicing Unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing quality and high speed dicing of difficult-to-cut materials as typified by SiC (silicon carbide), glass and alumina ceramics.
Features of ultrasonic-wave processing
Transmitting ultrasonic-wave oscillations to the blade improves water circulation at the processing point (elimination of clogging caused by the cutting dust discharge effect and cooling of the processing point) and promotes self-sharpening of the blade (elimination of blade glazing). Thus, normal blade condition can be maintained and process load can be reduced making highly efficient dicing possible.
Blade edge movement
Ultrasonic-wave oscillation mechanism
Retrofit available
Since this unit can be retrofitted to already shipped dicing saws, introducing ultrasonic-wave applications to your production line is a simple process. In addition, normal blades can be used even after the retrofit.
Unit configuration
- Ultrasonic-wave amplitude generation power unit
- Dedicated mount and blade
- Ultrasonic-wave oscillation measurement sensor
- Software
Application example
SiC
High feed speed and good processing quality can be realized
| Workpiece | 0.35 mm thick 4H-SiC wafer |
| Blade | 50 μm thick U09ZA- SD1500 |
| Feed speed | 10 mm/s 1Pass |
Glass
Greatly improved chipping and reduced street widths are realized by using the #2000 grit size, which previously could not be used.
| Workpiece | 0.3 mm thick borocillicate glass |
| Blade | 50 μm thick U09ZD- SD2000 |
| Feed speed | 3 mm/s 1Pass |
Blade for ultrasonic-wave dicing unit
U09SERIES
Specification
Ultrasonic-wave
Dicing Unit
Contact
Please feel free to contact us with any questions or inquiries.