DFG8640Fully Automatic Grinder
Pursuing high-precision grinding of various workpieces
- Φ200 mm
- 2 axes, 3 chuck tables
- DBG
High-precision grinding
High-precision grinding has been required for power devices and some sensors because thickness variations between wafers and within one wafer after grinding have an impact on product characteristics. The DFG8640 achieves high-precision grinding through the optimization of the processing point layout and installation of various mechanisms.
Available for various workpieces up to Φ8 inches
DFG8640 is a fully automatic grinder equipped with two spindles, three chuck tables, and one turntable. This equipment supports various workpieces up to Φ8 inches, including difficult-to-process materials such as Silicon, LT, LN, and SiC.
Mechanisms for high-precision grinding
A spindle axis with high rigidity, low vibration, and less rotation speed fluctuation has been installed to achieve high-precision, high-quality processing. For the chuck table axis, an air bearing unit with high rigidity, low vibration, low heat expansion, and less rotation speed fluctuation has been installed.
Improved usability
The new GUI (graphical user interface), which enables intuitive operations such as tapping and swiping in the same manner as smartphones and tablet devices, offers quick operation from one screen to the target screen without going through other screens.
Improved space productivity
The footprint is approx. 13% smaller than DFG8540. In addition, more than 1.2 times as many wafers as DFG8540 can be transferred by reducing the cleaning mechanism operation time and redesigning the transferring arm.
Work Flow System
- The robot pick removes the workpiece from the cassette and places it on the positioning table, where centering takes place.
- Transfer arm 1 positions the workpiece on the chuck table.
- The workpieces are ground at Z1 and Z2.
- Transfer arm 2 removes the workpiece from the chuck table and positions it on the spinner table.
- Cleaning and drying
- The robot pick returns the workpiece to the cassette
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Supported workpiece size | - | Φ8 inch | |
| Grinding method | - | In-feed grinding with wafer rotation | |
| Grinding wheel | - | Φ200 mm Diamond Wheel | |
| Spindle | Rated output | kW | 6 | Rotation speed range | min‐1 | 1,000 ～ 7,000 |
| Equipment dimensions (W x D x H) | mm | 1,000 x 2,800 x 1,800 | |
| Equipment weight | kg | Approx.3,500 | |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Spindle |
| C/T |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |  |  |  |
| DAG810 | DFG8340 | DFG8540 | DFG8560 | DFG8830 | DGP8761 |
| Automatic | Fully Automatic | Fully Automatic | Fully Automatic | Fully Automatic | Fully Automatic |
| 1 | 1 | 2 | 2 | 4 | 3 |
| 1 | 2 | 3 | 3 | 5 | 4 |
| 600 × 1,700 × 1,780 | 800 × 2,450 × 1,800 | 1,200 × 2,670 × 1,800 | 1,400 × 3,190 × 1,800 | 1,400 × 2,500 × 2,000 | 1,690 × 3,315 × 1,800 |
| 1,300 | 2,500 | 3,100 | 4,000 | 6,000 | 6,700 |
DFG8640Fully Automatic Grinder
Contact
Please feel free to contact us with any questions or inquiries.