This equipment is suitable for grinding difficult-to-process materials such as sapphire and SiC. DFG8830 is equipped with high power, high rigidity spindles and is compatible with large-diameter grinding wheels, making it possible to achieve fully automatic processing for difficult-to-process materials.
The 4-axis, 5-chuck table, and 1 turntable configuration offers solutions for a variety of applications. By selecting the optimal wheel for each of the 4 axes, this unit offers for low-damage, high-quality or high-productivity processing for a wide range of applications.
DFG8830 is compatible with workpieces bonded to substrates such as glass or ceramic. This equipment supports substrate sizes from Φ5 to 8-inch and workpieces with substrates up to a total thickness of 3.5 mm.
Optimal arrangement of the spindles and handling systems has resulted in a compact footprint of 3.5 m2, despite boasting an all-in-one, 4-axis, 5-chuck table configuration.
The intuitive icon-based GUI touch panel allows simple operation and on-screen step-by-step visualization of the processing stages. Also, with support for up to four cassettes, the cassette replacement frequency and equipment operation workload can be reduced.
|Wafer diameter||-||Φ4, 5, 6 inch|
|Substrate Diameter||-||Φ5, 6, 8 inch|
|Grinding method||-||In-feed grinding with wafer rotation|
|Grinding wheel||-||Φ300 mm Diamond Wheel|
|Revolution speed||min‐1||1,000 ～ 4,000|
|Machine dimensions (W x D x H)||mm||1,400 × 2,500 × 2,000|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.
|Machine dimentions（W × D × H）|