DFG8541Fully Automatic Grinder

A grinder for various materials with improved processing quality and usability

Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning

The next generation successor to the standard model, supports Φ8-inch wafers

DFG8541 is the next generation equipment of DFG8540, which is a dual-spindle standard model grinder that handles grinding of wafers 8 inches or smaller. DFG8541 can handle not only Si, but also hard and difficult-to-process materials such as SiC.

High-quality processing of various materials

By adding a high-torque spindle to the list of optional specifications, a wider variety of materials can be processed with DFG8541. In addition, by improving various mechanisms such as wafer shape adjustment (affects thickness variation) and wafer transfer and cleaning operations, high-quality processing can be achieved.

Mechanisms focused on high-quality processing

High-precision wafer shape adjustment can be performed on the screen using an electric fine adjustment axis. Contact with the wafer is minimized with a non-contact centering function that uses a camera, and a high level of cleanliness can be achieved through atomizing nozzle cleaning.

Improved usability

A new GUI and control system make intuitive operation possible. In addition, multiple functions that improve the usability of the equipment have been added, such as recipe selection per wafer for wafers in the same cassette, tape mounting irregularity detection, and slanted wafer storage and empty slot detection.

Small footprint, energy-saving design

With an optimized layout and built-in vacuum unit, the footprint is 15% smaller than DFG8540. In addition, air consumption has also been reduced by 50% due to the adoption of new air spindles.

Work Flow System

Robot pick unloads the workpiece from the cassette
Workpiece is centered on the positioning table
Transfer arm 1 transfers the workpiece to the chuck table
Z1/Z2-axis grinding
Transfer arm 2 transfers the workpiece to the spinner table
Workpiece is cleaned and then dried
Robot pick returns the workpiece to the cassette

Specifications

Specification		Unit
Supported workpiece size		-	Φ8 inch When using universal chuck table: Φ4, 5, 6, 8 inches
Grinding method		-	In-feed grinding with workpiece rotation
Grinding wheel		-	Φ200 mm diamond wheel
Spindle	Rated output	kW	4.2
Spindle	Rotation speed range	min^‐1	1,000 - 7,000
Equipment dimensions (W x D x H)		mm	1,100 × 2,800 × 1,800
Equipment weight		kg	Approx.3,000

Product Lineup



Machine type
Spindle
C/T
Machine dimentions（W × D × H）
Machine weight（kg）


DAG810	DFG8340	DFG8540	DFG8560	DFG8640	DFG8830	DGP8761
Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic	Fully Automatic
1	1	2	2	2	4	3
1	2	3	3	3	5	4
600 × 1,700 × 1,780	800 × 2,450 × 1,800	1,200 × 2,670 × 1,800	1,400 × 3,190 × 1,800	1,000 × 2,800 × 1,800	1,400 × 2,500 × 2,000	1,690 × 3,315 × 1,800
1,300	2,500	3,100	4,000	3,500	6,000	6,700