IF SERIESGrinding Wheels
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, DISCO offers applications and IF Series wheels to match virtually any wafer size or processing requirement.
- Superior finishing quality
- Long-life specification - high wear resistance
- Large product range - able to process compound semiconductor wafers and crystal materials
- Uses packaging made with environmentally-friendly PP or ABS resin.
Product Line-up
Rough grinding
A combination of a high rigidity vitrified bond and a large diamond grit are employed to achieve a stable grinding process.
- VS : Standard vitrified bond wheel
Fine grinding
By using a resin bond, which causes little damage to workpieces, a stable grinding process is attained. As a result, the thickness accuracy (TTV) is improved and process quality, together with wheel life is enhanced. Also, surface roughness is reduced.
- B-K01 : Enhances grinding quality
- B-K02 : Enhances wheel life.
- B-K04 : Standard resin bond wheel
- B-K09 : Enables high-load processing
Etched wafer grinding (for wafer manufacturers)
Capable of precision grinding to planarize etched wafers.
- B-M01 : Standard resin bond wheel for grinding etched wafers
Specification
Note on wheel selection
Processing results depend greatly on the combination of wheels for rough grinding (Z1) and fine grinding
(Z2).
DISCO offers expertise in process development to determine the right wheel for your application. Please
contact your DISCO representative for details.
IF SERIESGrinding Wheels
Contact
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.
- USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
- DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
- FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
- DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
- Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
- READ the operation manual of the cutting/grinding equipment before use.
- DO NOT USE the precision tooling with modified or customized equipment.
- DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
- DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
- Always USE water or coolant to prevent precision tooling damage.