Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, DISCO offers applications and IF Series wheels to match virtually any wafer size or processing requirement.
A combination of a high rigidity vitrified bond and a large diamond grit are employed to achieve a stable grinding process.
By using a resin bond, which causes little damage to workpieces, a stable grinding process is attained. As a result, the thickness accuracy (TTV) is improved and process quality, together with wheel life is enhanced. Also, surface roughness is reduced.
Capable of precision grinding to planarize etched wafers.
Processing results depend greatly on the combination of wheels for rough grinding (Z1) and fine grinding
DISCO offers expertise in process development to determine the right wheel for your application. Please contact your DISCO representative for details.
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.