Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to
This base delivers grinding water even more efficiently than the IF Series, resulting in highly consistent processing and optimized wheel life.
By combining various bond types and grit sizes, the GF01 Series realizes stable film processing and thin grinding of the wafer backside.
Handles a variety of materials, including oxide and nitride layers, and realizes consistent processing results.
Specially-formulated resin bonds allow for reduced depth of damage and highly dependable grinding quality. Designed for improved TTV and surface roughness, the GF01 Series fine-grinding wheels combine high processing quality with optimized wheel life.
Processing results depend greatly on the combination of wheels for rough grinding (Z1) and fine grinding
DISCO offers expertise in process development to determine the right wheel for your application. Please contact your DISCO representative for details.
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.