Normally the dicing saw is used to cut the processed material into die, but profiling is also possible by making use of the blade shape.

Process Example

The photograph shows silicon grooved to make columns with a width of 1µm and height of 30µm.
This process is possible because process damage from the blade is minimized and the machine operation is highly precise.
Profiling can be used for production of minute parts or samples for inspection.

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