The dicing saw is normally used to cut a workpiece into die, but it can also perform profiling by utilizing the shape of the blade.

Process Example

The photograph shows the result when grooving silicon (Si) into pillars 1 µm square with a height of 30 µm.
This can be realized only when the machine operation is highly accurate and process damage caused by the blade is at its minimum.
Profile processing can be used when producing microparts and testing samples.

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