Thick Wafer Dicing Using Blade Dicing Saws
Application processing examples
Although blade dicing saws are generally used to singulate wafers, they are also able to process thick substrates when installed with a user-specified specification. DISCO responds to customers’ varied needs with customized solutions by utilizing the manufacturing technology of its equipment and consumables.
Processing Examples
Soda-lime Glass
The following is a photograph of 60 mm deep grooving into a soda-lime glass block using a blade dicing saw.
Cutting Depth : 60 mm
Carbon
The following is a photograph of 67 mm deep grooving into a carbon block using a blade dicing saw.
Cutting Depth : 67 mm
Ceramic
The following is a photograph of 49 mm deep grooving into a ceramic block using a blade dicing saw.
Cutting Depth : 49 mm
PZT (Lead zirconate titanate)
The following is a photograph of 48 mm deep grooving into a PZT block using a blade dicing saw.
Cutting Depth : 48 mm
Contact
Please feel free to contact us with any questions or inquiries.
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Applications Support
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
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Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.
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