The mechanical strength of low-K film used as insulating film for high-speed logic is low, and thus, there is the risk of film peeling when the normal blade dicing process is used. The low-K grooving process removes the wiring layer, including the low-K film, using laser grooving equipment.

Application

Laser grooving process

First, the DFL7161 rapidly makes two laser grooves in the dicing street - either "Pi Laser Grooving" or "Omega Laser Grooving"; then the wafer is blade-diced at standard speed. This application achieves excellent throughput yet greatly reduces or eliminates chipping, delamination and other cut-quality issues.

Application Example

Equipment

Precision and Ease of Use

The DFL7161 (300 mm compatible) Fully Automatic Laser Saw utilizes short pulse laser technology to groove the streets of Low-k and Cu wafers with little or no heat damage. An LCD touch screen graphical user interface allows for excellent ease of operation.

Laser

Cutting Quality

The DFL7161 focuses a short pulse UV laser on the surface of the wafer. Each pulse is absorbed by the Low-k material. After successive laser pulses, sufficient energy is absorbed to cause the Low-k material to vaporize. The vaporized material carries away the energy from the interaction, thereby minimizing heat transfer to the surrounding material.

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