Applications: Silicon wafer, etc
The DP08 Series realizes ultra-thin wafer polishing using the DISCO dry polishing process. This chemical-free process not only has a lower environmental load but also improves die strength with easier operation over processes that use slurry.
Damage has been removed from the wafer processed with dry polishing
Workpiece | Φ8” Silicon wafer |
Final grinding thickness | 200 µm |
Wheel | DP08 |
Ra (µm) | 0.0003 |
Ry (µm) | 0.0017 |
Wheel | Grinding wheel (#2000) |
Ra (µm) | 0.0150 |
Ry (µm) | 0.0800 |
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.