Applications: Silicon wafer, etc
In addition to wafer polishing in the conventional grinding process, the DP08 realizes chemical-free stress relief that can even be used with the DBG process.
Damage has been removed from the wafer processed with dry polishing
|Workpiece||Φ8” Silicon wafer|
|Final grinding thickness||200 µm|
|Wheel||Grinding wheel (#2000)|
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.