Gettering DPDry Polishing Wheels
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc
Due to the ultra-thinning of wafers, loss of gettering performance becomes a major concern. Gettering DP is a new solution which realizes high die strength and good gettering performance at the same time using DISCO’s unique dry polishing process.This chemical-free process has a low environmental impact and polishes thin wafers with a simple process that does not involve using a slurry.
Lineup of two types according to application
Gettering DP wheels are offered in two types according to the application. In contrast to the standard GA-type, the MZ-type is a DP wheel which increases the die strength of the polished wafer, allowing for an even thinner finish. However, the MZ-type requires detailed polishing condition selection according to the workpiece. Please contact us if you wish to use the MZ-type.
| GA*** type | Standard gettering DP wheel |
| MZ*** type | A gettering DP wheel which increases die strength more than the GA-type, realizing an even thinner finish |
Experimental Data
Die Strength Comparison (3-point bending)
* Finish thickness: 25 µm Process: DBG （Dicing Before Grinding）
Gettering Effect
The amount of precipitated Cu detected on the polished surface of a mirror wafer exceeds 1.0 E11 after a copper solution is applied to the surface. In contrast, the amount of precipitated Cu detected on the backside of a wafer polished with a Gettering DP is below the detection limit, thus indicating that the surface had a gettering effect.
TXRF measurement data before and after Cu solution application (Φ8 inch mirror wafer)
To quantitatively measure the gettering effect, samples were contaminated with a Cu solution. The Cu was diffused at 350 ºC for 3 hours and then analyzed using TXRF (Total-Reflection X-ray Fluorescence). Take a Gettering DP polished wafer for example; the amount of Cu detected on the opposite surface (mirror surface) is analyzed with TXRF after diffusing the Cu on the polished surface and contaminating with Cu.
※ Detectable range at below 0.5E10 atoms/cm2
Specifications
Gettering DPDry Polishing Wheels
Contact
Please feel free to contact us with any questions or inquiries.
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without
advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely
Please read carefully and follow the instructions below to prevent any accidents or injuries.
- USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
- DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
- FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
- DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
- Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
- READ the operation manual of the cutting/grinding equipment before use.
- DO NOT USE the precision tooling with modified or customized equipment.
- DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
- DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
- Always USE water or coolant to prevent precision tooling damage.