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DFL7341Fully Automatic Laser Saw

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FAQ

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing

Φ200 mm
Stealth Dicing™
SDBG
SDTT

DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.

Height adjustment function

Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage.

Wafer shape recognition

Wafer shape is measured using a high-resolution sensor to singulate at the optimal processing area.

Compatibility with various materials

High-quality processing can be achieved for sapphire, SiC, and GaAs using laser oscillators suited for each material.

DISCO is an alliance partner^* of Hamamatsu Photonics, which owns the portfolio of patents for Stealth Dicing technology.

*System integrators who are business partners with comprehensive licensing for the portfolio of patents for Hamamatsu Stealth Dicing technology.
https://www.hamamatsu.com/jp/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-technology/alliance-partners.html

Specifications

Specification		Unit
Processing method		-	Stealth Dicing™
Max. workpiece size		mm	Φ200
X-axis (Chuck table)	Processing range	mm	210
X-axis (Chuck table)	Moving speed	mm/s	1 ～ 1,000
Y-axis (Chuck table)	Processing range	mm	210
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003/210 (Single error)0.002/5
Z-axis	Moving resolution	mm	0.0001
Z-axis	Repeatability accuracy	mm	0.001
θ-axis (Chuck table)	Max. rotating angle	deg	380
Equipment dimensions (W×D×H)		mm	950 × 1,732 × 1,800
Equipment weight		kg	Approx. 1,800

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

Product Lineup



Machine type
Method
Machine dimentions（W × D × H）
Machine weight（kg）

DFL7362

Fully Automatic

Stealth Dicing™

1,600 × 2,755 × 1,800

2,850

Equipment models that support Stealth Dicing are equipped with an SD engine, which has a modularized laser and optical system developed by Hamamatsu Photonics for DISCO.