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DFL7362Fully Automatic Laser Saw

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Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si

Φ300 mm
Stealth Dicing™
SDBG
SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

High throughput

UPH is improved by approx. 30% through increased maximum X-axis speed and acceleration in addition to reduced wafer transfer and alignment times.

Wide range of options

DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

DISCO is an alliance partner^* of Hamamatsu Photonics, which owns the portfolio of patents for Stealth Dicing technology.

*System integrators who are business partners with comprehensive licensing for the portfolio of patents for Hamamatsu Stealth Dicing technology.
https://www.hamamatsu.com/jp/en/product/semiconductor-manufacturing-support-systems/stealth-dicing-technology/alliance-partners.html

Specifications

Specification		Unit
Processing method		-	Stealth Dicing™
Max. workpiece size		mm	Φ300
X-axis (Chuck table)	Processing range	mm	310
X-axis (Chuck table)	Moving speed	mm/s	0.1 ～ 2,000
Y-axis (Chuck table)	Processing range	mm	310
	Index step	mm	0.0001
	Positioning accuracy	mm	0.003/310 (Single error)0.002/5
Z-axis	Moving resolution	mm	0.000005
Z-axis	Repeatability accuracy	mm	0.001
θ-axis (Chuck table)	Max. rotating angle	deg	380
Equipment dimensions (W×D×H)		mm	1,600 × 2,755 × 1,800
Equipment weight		kg	Approx. 2,850

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.

Product Lineup



Machine type
Method
Machine dimentions（W × D × H）
Machine weight（kg）

DFL7341

Fully Automatic

Stealth Dicing™

950 × 1,732 × 1,800

1,800

Equipment models that support Stealth Dicing are equipped with an SD engine, which has a modularized laser and optical system developed by Hamamatsu Photonics for DISCO.