UPH is improved by approx. 30% through increased maximum X-axis speed and acceleration in addition to reduced wafer transfer and alignment times.
DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.
Specification | Unit | ||
---|---|---|---|
Processing method | - | Stealth Dicing™ | |
Max. workpiece size | mm | Φ300 | |
X-axis (Chuck table) |
Processing range | mm | 310 |
Moving speed | mm/s | 0.1 ~ 2,000 | |
Y-axis (Chuck table) |
Processing range | mm | 310 |
Index step | mm | 0.0001 | |
Positioning accuracy | mm | 0.003/310 (Single error)0.002/5 |
|
Z-axis | Moving resolution | mm | 0.000005 |
Repeatability accuracy | mm | 0.001 | |
θ-axis (Chuck table) |
Max. rotating angle | deg | 380 |
Machine dimensions (W×D×H) | mm | 1,600 × 2,755 × 1,800 | |
Machine weight | kg | Approx. 2,850 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Please feel free to contact us with any questions or inquiries.