*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
Achieves high-quality processing with less processing distortion and deformation due to heating.
DFL7160 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
Specification | Unit | ||
---|---|---|---|
Processing method | - | Ablation | |
Max. workpiece size | mm | Φ300 | |
X-axis (Chuck table) |
Processing range | mm | 310 |
Moving speed | mm/s | 0.1 ~ 600 | |
Y-axis (Chuck table) |
Processing range | mm | 310 |
Index step | mm | 0.0001 | |
Positioning accuracy | mm | 0.003/310 (Single error) 0.002/5 |
|
Z-axis | Moving resolution | mm | 0.00005 |
Repeatability accuracy | mm | 0.002 | |
θ-axis (Chuck table) |
Max. rotating angle | deg | 380 |
Equipment dimensions (W×D×H) | mm | 1,200 × 1,550 × 1,800 | |
Equipment weight | kg | Approx. 1,750 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Please feel free to contact us with any questions or inquiries.