*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
*Elevator cover is user-specified spec.
DFL7161 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.
Maximum speed is increased through improved transfer and processing axis performance, achieving higher productivity.
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.
Specification | Unit | ||
---|---|---|---|
Processing method | - | Ablation | |
Max. workpiece size | mm | Φ300 | |
X-axis (Chuck table) |
Processing range | mm | 310 |
Moving speed | mm/s | 1 ~ 1,000 | |
Y-axis (Chuck table) |
Processing range | mm | 310 |
Index step | mm | 0.0001 | |
Positioning accuracy | mm | 0.003/310 (Single error) 0.002/5 |
|
Z-axis | Moving resolution | mm | 0.000015 |
Repeatability accuracy | mm | 0.002 | |
θ-axis (Chuck table) |
Max. rotating angle | deg | 330(standard) 380(option) |
Equipment dimensions (W×D×H) | mm | 1,560 × 1,550 × 1,800 | |
Equipment weight | kg | Approx. 2,300 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Please feel free to contact us with any questions or inquiries.