PRECUTBOARD® is a precutting tool for blade conditioning. Compared to conventional silicon wafers, it greatly reduces precut-related costs by significantly shortening processing time.
PRECUTBOARD® reduces the time needed for precutting down to between 1/10 and 1/20 of the time needed when using silicon wafers. Various other benefits can also be expected, including workload and dicing tape expense reduction as well as improved dicing saw operation rates.
In product wafer dicing, processing metal films, resin films, DAF, and other malleable materials on the street can cause blade loading, which deteriorates processing quality. However, by using a PRECUTBOARD® for interval dressing, loading can be removed, and blade sharpness can be restored.
PRECUTBOARD® is a registered trademark of DISCO Corporation in Japan and other countries.
To place an order
Provide the type, dimensions, and quantity of PRECUTBOARD®. For new orders, a DISCO sales representative will help select a suitable product. In this case, please let us know the processing material, dimensions, shape, and machine used (equipment) for your product, along with any other conditions.
*Specifications are subject to improvement-related changes without prior notice. Please check the specification before placing an order.
To use PRECUTBOARD® safely
Please read and follow the instructions below to prevent accidents or injuries related to the PRECUTBOARD®