DDS2010Automatic Die Separator
High yield and high throughput separation of small die processed with Stealth Dicing™
- Φ200 mm
- SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using Stealth Dicing™ process (SD)※.
*Stealth Dicing™ is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors.
High throughput
Scan breaking can be performed at a set speed for the stable separation of any die size. This is faster than 3-point breaking which requires the breaking bar to stop at each line.
Tape expansion and scan breaking
- The scan breaking bar ensures 100% singulation of unseparated die after tape expansion.
- After separation, the wafer is transferred to a tape frame matching the size of the wafer being processed while maintaining the space between the die.
Processing time halved
| Wafer | Φ8 inch x 0.1 mm thick |
| Die size | 0.5 × 0.5 mm |
Note: These are DISCO measurements and sample process times.
These results cannot be guaranteed for all conditions
Process flow
No pattern side protective film required during breaking
Reduced die damage during expansion
Specifications
| Specification | Unit | |
|---|---|---|
| Max. workpiece size | - | Φ8 inch |
| Dice size | mm | 0.1～0.5 (narrow side) Max. 20 mm (long side) *long die only |
| Wafer mounting accuracy X/Y direction (frame mount) | mm | ±2.5 |
| Wafer mounting accuracy θ direction (frame mount) | ° | ±3° |
| Equipment dimensions (W×D×H) | mm | 718 × 897 × 1,608 (including status indicator) |
| Equipment weight | kg | Approx.450 |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |
| DDS2300 | DDS2310 | DDS2320 |
| Fully Automatic | Fully Automatic | Fully Automatic |
| 1,200 × 1,550 × 1,800 | 1,200 × 1,800 × 1,955 | 1,300 × 1,800 × 1,800 |
| 900 | 1,000 | 1,126 |
DDS2010Automatic Die Separator
Contact
Please feel free to contact us with any questions or inquiries.