DDS2320Fully Automatic Die Separator
A die separator that realizes high productivity and high reliability through specialized functions for the memory market (large die)
- Φ300 mm
- SDBG
- SDTT
Stable die separation after the SDBG (Stealth DicingTM Before Grinding) process
Achieves stable die separation for wafers and DAF that have a modified layer formed inside them using the Stealth DicingTM process.
Improved productivity and post-processing device reliability
High productivity and high device reliability are achieved with the newly developed expansion unit, workpiece inversion mechanism, and more.
High productivity
- Cool expansion and heat shrinking in one unit
DDS2320 can perform both the cool expansion and heat shrinking processes inside one unit. As workpiece transfer between units is no longer required, DDS2320 achieves reduced risk of damage during transfer and improved productivity. - Parallel processing with dual-expansion unit
DDS2320 has two expansion units installed, enabling parallel processing, through which improved productivity can be expected. As with the previous model, DDS2320 can proceed directly to the die bonding process with the tape frame after heat shrinking.
Improved post-processing device reliability
Particle adhesion is reduced by performing transfer, processing, and cleaning after inverting the workpiece. This leads to improved device reliability and yield.
- Inverted cool expansion / heat shrinking
Re-adhesion is prevented by performing expansion and heat shrinking after turning the workpiece surface downward, causing the particles produced during die singulation / tape shrinking to fall off. - Inverted spinner cleaning / transfer
Spinner cleaning is performed after die singulation, with the workpiece surface still facing downward. This process contributes to further reduction of particle adhesion.
Approximately 40% footprint reduction
In previous models, multiple auxiliary equipment were installed in the area around the main equipment. DDS2320 achieves a smaller footprint by having the auxiliary equipment installed internally.
Specifications
| Specification | Unit | ||
|---|---|---|---|
| Max. workpiece size | mm | Φ300 (Φ12inch tape frame only) |
|
| Expansion stage | Temperature setting range | ℃ | -2–30℃(variable) |
| Max. upthrust amount | mm | 30 | |
| Upthrust amount setting range | mm | 0–30 (step: 0.001) | |
| Max. upthrust speed | mm/s | 400 | |
| Upthrust speed setting range | mm/s | 0.001–400 (step: 0.001) | |
| Hot air, temperature setting range | ℃ | 150–250ºC (variable) | |
| Hot air, flow rate setting range | L/mm | 0–30 (variable) | |
| Equipment dimensions (W × D × H) | mm | 1,300 × 1,800 × 1,800 | |
| Equipment weight | kg | Approx. 1,126 | |
*Product appearance, features, specifications, and other details may change due to technical
modifications.
*Please read the standard specification sheet thoroughly before use.
Product Lineup
| Machine type |
| Machine dimentions（W × D × H） |
| Machine weight（kg） |
 |  |  |
| DDS2010 | DDS2300 | DDS2310 |
| Automatic | Fully Automatic | Fully Automatic |
| 718 × 897 × 1608 | 1,200 × 1,550 × 1,800 | 1,200 × 1,800 × 1,955 |
| 450 | 900 | 1,000 |
DDS2320Fully Automatic Die Separator
Contact
Please feel free to contact us with any questions or inquiries.