DDS2310 achieves high-quality die separation for wafers with a modified layer formed through Stealth Dicing™ process. This equipment is effective for small die after Stealth Dicing™ process.
By installing FIR (Far Infrared) heaters and a heater expansion table developed for small-die separation, a sufficient kerf width for small die can be maintained.
The installation of four FIR heaters improves the tape shrink performance and UPH for separation of small die.
Adoption of the cool expansion method enables stable DAF separation as well as small-die separation.
Sagging that occurs around the periphery of the dicing tape after expansion can be eliminated through heat shrinking. This enables the workpiece to be transferred to the subsequent die bonding process while it is still mounted on tape and frame and eliminates the need to replace the tape.
|Max. workpiece size||mm||Φ300|
|Cooler stage||Temperature setting range||℃||0 or -5 (fixed)
(setting when shipped from the Plant)
|Max. upthrust amount||mm||30|
|Upthrust amount setting range||mm||0～30 (step 0.001)|
|Max. upthrust speed||mm/s||400|
|Upthrust speed setting range||mm/s||0.001 ～ 400 (step 0.001)|
|Heat shrink stage||Hot air temperature setting range||℃||400 ～ 600|
|Max. upthrust amount||mm||20|
|Upthrust amount setting range||mm||0 ～ 20 (step 0.001)|
|Max. up thrust speed||mm/s||50|
|Upthrust speed setting range||mm/s||0.001 ～ 50 (step 0.001)|
|Machine dimensions (W×D×H)||mm||1,200 × 1,800 × 1,955|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.