DDS2310Fully Automatic Die Separator

Die separator for small-die wafers

Φ300 mm
SDBG
SDTT

Achieves stable separation for small die after Stealth Dicing™ process

DDS2310 achieves high-quality die separation for wafers with a modified layer formed through Stealth Dicing™ process. This equipment is effective for small die after Stealth Dicing™ process.

Maintains a sufficient and constant kerf width

By installing FIR (Far Infrared) heaters and a heater expansion table developed for small-die separation, a sufficient kerf width for small die can be maintained.

Improves productivity through the installation of four FIR heaters as a standard feature

The installation of four FIR heaters improves the tape shrink performance and UPH for separation of small die.

Cool expansion increases DAF separation quality

Adoption of the cool expansion method enables stable DAF separation as well as small-die separation.

Tape frame transfer moves the workpiece smoothly to the next process

Sagging that occurs around the periphery of the dicing tape after expansion can be eliminated through heat shrinking. This enables the workpiece to be transferred to the subsequent die bonding process while it is still mounted on tape and frame and eliminates the need to replace the tape.

Application examples

Die separation after Stealth Dicing™ process
DAF separation after DBG/SDBG
DAF separation after blade dicing

Work Flow System

The push-pull arm retrieves the workpiece from the cassette and transfers it to the frame centering stage. →
The workpiece is aligned on the frame centering stage, then transferred to the intermediate stage. →
The workpiece is transferred to the cooler expansion stage, and cool expansion is performed. →
The workpiece is transferred to the heater expansion stage, and re-expansion and heat shrinking are performed. →
The workpiece is transferred to the spinner stage, where it is cleaned and dried. →
The workpiece is transferred to the UV irradiation stage (optional accessory) and UV irradiation is performed. →
The push-pull arm returns the workpiece to the cassette.

Specifications

Specification		Unit
Max. workpiece size		mm	Φ300
Cooler stage	Temperature setting range	℃	0 or -5 (fixed) (setting when shipped from the Plant)
	Max. upthrust amount	mm	30
	Upthrust amount setting range	mm	0～30 (step 0.001)
	Max. upthrust speed	mm/s	400
	Upthrust speed setting range	mm/s	0.001 ～ 400 (step 0.001)
Heat shrink stage	Temperature setting range	℃	400 ～ 600
	Max. upthrust amount	mm	20
	Upthrust amount setting range	mm	0 ～ 20 (step 0.001)
	Max. up thrust speed	mm/s	50
	Upthrust speed setting range	mm/s	0.001 ～ 50 (step 0.001)
Equipment dimensions (W×D×H)		mm	1,200 × 1,800 × 1,955
Equipment weight		kg	Approx.1,000

*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.