When the dry etcher is combined with the
DBG process, it can improve die strength even further than when processing with common grinding,
because the etcher can remove the die side surface damage from blade dicing.
Also, with this process, there is no mechanical damage due to dicing, because the stress relief process is performed after die separation has taken place.
As a result, this process shows promise in reliability improvement of those devices that undergo external stress after packaging, such as IC cards.
Products for Dry Etcher
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.