The simultaneous multiple-piece grinding using the frame chuck is introduced this time.

Simultaneous multiple-piece grinding method

Mount multiple workpieces on the tape affixed to the dicing frame, secure it to the DAG810 chuck table and perform grinding.

Applicable workpieces

Various workpiece shapes such as small round, oval and rectangular are applicable. (Either the 8- or 12-inch chuck table can be selected.)

Workpieces actually processed

Workpiece (molded die) largely warped due to the stress that occurred during resin coating after packaging, a quartered Si wafer, Si die, LT package substrate, gallium arsenic base, sapphire base, etc.

This function can be installed as a user-specified specification. For details, contact your DISCO sales representative.

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