The advantages of processing GaAS wafers on tape was previously introduced in "GaAs Wafer Thinning with Tape Securing Process". This article will present examples of ø6-inch GaAs wafer thinning on tape.

Processing Example

A 90 µm finish could be realized without any problem when a 6-inch GaAs wafer was processed after being secured with tape. Its handling did not produce any problem. The wheels used were #600 and #4800 for rough and finish grinding respectively.

Surface roughness (after finish grinding)

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