Application processing examples
The advantages of processing GaAS wafers on tape was previously introduced in "GaAs Wafer Thinning with Tape Securing Process". This article will present examples of ø6-inch GaAs wafer thinning on tape.
A 90 µm finish could be realized without any problem when a 6-inch GaAs wafer was processed after being secured with tape. Its handling did not produce any problem. The wheels used were #600 and #4800 for rough and finish grinding respectively.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.