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Reducing wafer edge chipping by optimizing the fine grinding amount

Application processing examples

Wafer edge chipping can lead to poor wafer strength and breakage. By optimizing the amount ground during fine grinding, it is possible to remove the large chipping generated during rough grinding.

  • Low fine grinding amount

    Low fine grinding amount
    The chipping generated during rough grinding remains
  • Optimized fine grinding amount

    Optimized fine grinding amount
    The chipping generated during rough grinding is removed

Optimizing the fine grinding amount reduces both the size and amount of chipping.


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