Application processing examples
Wafer edge chipping can lead to poor wafer strength and breakage. By optimizing the amount ground during fine grinding, it is possible to remove the large chipping generated during rough grinding.
Low fine grinding amount
Optimized fine grinding amount
Optimizing the fine grinding amount reduces both the size and amount of chipping.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.