Application processing examples
When attaching a BG tape on a wafer having a large unevenness in its pattern, the BG tape surface becomes
uneven. This unevenness transfers to the wafer after grinding, which may deteriorate TTV.
In this case, it is possible to improve TTV after grinding by planarizing the uneven BG tape surface.
<Process flow and actual results>
|Step||Grinding only||Planarization of BG tape surface + grinding|
|Attaching BG tape||BG tape surface becomes uneven
|Planarization of the BG tape surface||-|
|TTV after grinding
Unevenness of the BG tape transferred to the wafer, which deteriorated TTV.
Since there is no unevenness in the BG tape, TTV of the wafer after grinding improved.
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.