The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. By using this method, it lowers the risk of thin wafer handling and lowers warpage.
Improves the ease of wafer handling
Improves the ease of processing (through hole formation, bump distribution, etc) after thinning
*The wafer can maintain its structure (shape) without using a hard substrate.
Wafer hold based on hard substrate
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.