大口径晶圆或小芯片等在切割时间较长的状态时,由于受切削水长时间接触加工产品的影响,可能导致芯片焊点腐蚀的发生。 通过在切割水中添加StayClean301,使加工产品的表面形成极薄的保护层,防止芯片焊点的腐蚀以及因芯片焊点腐蚀而导致的键合不良。
和芯片焊点相同,轮毂刀片长时间和切削水接触时也可能发生腐蚀的现象。刀刃侧面的尖细化会导致切割痕变窄或刀片破损等问题。通过在切割水中添加StayClean301,使刀片的表面形成极薄的保护层,防止刀片的腐蚀。
在使用纯水切割时,即便是Spinner清洗后还是能看到微粒的残渣。但是,通过在切割水中添加StayClean301切割时,便可防止晶圆表面的微粒附着,防止Spinner清洗后的微粒残渣。
通过专为StayClean而开发的StayClean注入器,即使是1000倍以上的低稀释浓度,也可实现稳定的供给。
Specification | Unit | StayClean301 | StayClean Injector |
---|---|---|---|
Solution appearance | - | Transparent liquid with light or no coloring | |
Main ingredient | - | Surfactant + water soluble + water soluble polymer macromolecule | |
pH(undiluted) | pH | 5.5 - 7 | |
Density(25℃) | g/cm3 | 1.00 - 1.05 | |
Residue/decomposition | mg/L | COD 31(JIS K1002-17) | |
(when diluted 3000 times) | mg/L | BOD 12(JIS K0102-21) | |
Recommended dilution | times | 1,500 - 5,000(0.06 - 0.02%) | |
Power supply , voltage | V | AC90-230 Single Phase 50/60 Hz | |
Supply water temperature | deg C | 20 - 25 | |
Supply water pressure | MPa | 0.2 - 0.5 | |
Process flow rate | L/min | 2 - 20 | |
Additive injection rate | % | 0.1 - 0.01(1,000 - 100 ppm) | |
Equipment dimensions(W×D×H) | mm | Injector 200 × 300 × 500 excluding projections Bottle stocker 357 × 392 × 440 excluding projections |
|
Equipment weight | kg | Injector Approximately.22(Dry mass) Bottle stocker Approximately.10(Dry mass) |
Cautions before using StayClean301
Cautions regarding the use of StayClean301
Cautions regarding StayClean301 storage